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      1. 技術服務

        Summary

        來源: 發布時間:2014-6-3 9:56:05 瀏覽次數:565

           

        Summary

                The company has a professional package design and simulation team, equipped with a complete, advanced equipment, follow the international recognized quality standards. We provide customers with the best package design and high quality product quality.

           We provide customers including wire bonding package, flip chip packaging, chip scale package (CSP), SIP packaging products, MEMS packaging products, such as advanced manufacturing technology.

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